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S2P won THALES CHALLENGE and will participate to Viva Technology 2018

S2P will be at Viva Technologie 2018, the world’s rendez-vous for start-ups & leaders, with more than 80’000 participants and prestigious guests.

THALES is a key partner for S2P. World leader of electronics solutions for aerospace, security and defence, S2P collaborates with several entities of the group since several years now, working on optimizing the integration and performance of electronics functions in miniaturized and constraint plastic packagings with 3D-MID technologies.

This is a special year for us as we won the THALES CHALLENGE for Viva Technology 2018 THALES, so that THALES invited us on their lab (L15-011) to show our activities, products and solutions.

More details on :
– Chaine Youtube Thales :

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Only 10 days to submit your abstract – IEEE supported 13th International Congress Molded Interconnect Devices (MID 2018)

With only 10 days left to submit your abstract for the IEEE-supported  13th International Congress Molded Interconnect Devices (MID 2018) to be held on September 25th – 27th, 2018 at the Congress Centrum in Würzburg, Germany we cordially invite you to submit your paper : 2ndCfP_MID2018_en


  • Innovation with MID
  • MID – Implementation and Realization
  • Integrated CAD / CAM Systems
  • Materials for MID
  • Plastics Processing
  • Metallization
  • Structuring of Circuit Paths
  • 3D Assembly
  • Quality Assurance
  • Printed Electronics
  • Future Trends

All abstracts selected for the scientific track will be listed at IEEE Xplore.

Please submit your abstract until March 31st, 2018.

Further information on


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DSEI – D-DAY – Come to visit us!


DSEI, one of the major event for defense will take place in London from 12th to 15th September 2017.

S2P will exhibit our 3D-MID / Plastronics innovative solutions in defense and hope to meet you in our booth N7-443

More details on DSEI 2017 Website



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S2P cooperate with Airbus for 3D-MID integration in helicopters

S2P cooperated with Airbus to study a 3D-MID solution to simplify the assembly of helicopters cyclic grips.

Our technologies have made it possible to substitute traditional wiring with conductive tracks directly integrated on the 3D surfaces of a plastic parts.

The prototype displayed at the Paris Air Show 2017 shows the potential of 3D-MID in the automation of the production of such aeronautical systems.


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ISO 9001 Certification


The quality of our organisation is now testified by ISO 9001 Certification.

The certification has been achieved with ZERO NON-CONFORMITIES

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FIP Trade Event – at Lyon Eurexpo

S2P and its partner IPC will be present at the FIP trade show at Lyon Eurexpo (from 16th to 18th of June 2017).

This will be the occasion to present our know-how and our latest achievements in 3D-MID for the industry.

We hope to see all of you.


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DSEI 2017 Trade Show – London

For the first ever S2P will present its expertise at the DSEI Show from September the 12th to 15th.

It will be a nice occasion to meet each other and to look at the great possibilities offered by the MID technology.

MID (or Plastronics) allows implementing electronics functions (antennas, lighting, sensor, RFID…) direct on the plastic support with numerous advantages like miniaturization, weight reduction, ergonomics improvement…

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Paris – Intermeditec 2017

S2P will be present at Paris Intermeditec exhibition, from May 16th until May 18th.

You can find us on the Stand E10 with IPC our partner.

Reminder: our 3D-MID Technology allows us to manufacture sub-assemblies for Medical Industry combining miniaturization and ergonomics by integrating different electronic components (e.g. LED, Sensor, Antennas…) direct on the plastic support.




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The company S2P is now full member of the Defense cluster named EDEN.

Recognised by the French Government, the internationally well-known EDEN cluster validates our company strategy in this business and is the royal way for us to meet innovative and customer-orientated middle-sized suppliers in the Defense and Security Industry.
More information about EDEN