S2P cooperated with Airbus to study a 3D-MID solution to simplify the assembly of helicopters cyclic grips.
Our technologies have made it possible to substitute traditional wiring with conductive tracks directly integrated on the 3D surfaces of a plastic parts.
The prototype displayed at the Paris Air Show 2017 shows the potential of 3D-MID in the automation of the production of such aeronautical systems.
The quality of our organisation is now testified by ISO 9001 Certification.
The certification has been achieved with ZERO NON-CONFORMITIES
S2P and its partner IPC will be present at the FIP trade show at Lyon Eurexpo (from 16th to 18th of June 2017).
This will be the occasion to present our know-how and our latest achievements in 3D-MID for the industry.
We hope to see all of you.
For the first ever S2P will present its expertise at the DSEI Show from September the 12th to 15th.
It will be a nice occasion to meet each other and to look at the great possibilities offered by the MID technology.
MID (or Plastronics) allows implementing electronics functions (antennas, lighting, sensor, RFID…) direct on the plastic support with numerous advantages like miniaturization, weight reduction, ergonomics improvement…
S2P will be present at Paris Intermeditec exhibition, from May 16th until May 18th.
You can find us on the Stand E10 with IPC our partner.
Reminder: our 3D-MID Technology allows us to manufacture sub-assemblies for Medical Industry combining miniaturization and ergonomics by integrating different electronic components (e.g. LED, Sensor, Antennas…) direct on the plastic support.
The company S2P is now full member of the Defense cluster named EDEN.
Recognised by the French Government, the internationally well-known EDEN cluster validates our company strategy in this business and is the royal way for us to meet innovative and customer-orientated middle-sized suppliers in the Defense and Security Industry.
The first colloquium organized by SFIP on plastronics and 3D MID technologies will take place in Grenoble, next March 8-9 2017.
Don’t forget to register quickly ! More details here : http://www.sfip-plastic.org/evenements/624/
DIC recently developped a new grade of PPS (polyphenylene sulfide) compatible with LDS technology.
PPS is a high-performance semi-crystalline polymer, chemically, mechanically and thermally resistant, which can be used above 200° C.
It is widely used in automotive industry, but also for electrical and electronic equipment, and more generally in industry (water distribution for example).
It enlarges the possibilities for 3D MID solutions, with an intermediate plasticl (performance & price) between PA and LCP / PEEK.
More details to download :
– Newsletter DIC on the arrival of the PPS LP-150-LDS : Newsletter DIC-PPS 13 – New Compound for Laser Direct Structuring
– Datasheet of PPS LP-150-LDS: LP-150-LDS ISO Data sheet_2016-12
There is now a wide range of materials compatible with our LDS technology: ABS, ABS/PC, COP, LCP, PBT, PC, PEEK, PEI, PET, PA, PPA, PPE
Should you need more information, do not hesitate to contact us (firstname.lastname@example.org)