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New LDS materials, always more efficient

LPKF-LDS (Laser Direct Structuring) technology is the most advanced 3D-MID technology, with more than 20 years of experience in many sectors. To meet the requirements of new markets, materials and compounders regularly create new grades.

S2P, the only French company approved by LPKF as an « Autorized LDS manufacturer », invites you to try these new materials for your next projects :

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14th 3D-MID Congress : Extension of the Deadline for abstracts submission

Dear partners,

First of all, we hope that you, your family and all your collaborators are fine, considering the difficult period we are currently facing with Covid19.

For your information, the next 3D-MID International Conference will be held on September 29th  and 30th , 2020 in Amberg, Germany. S2P is still part of the organizing committee. The deadline for abstract submission has been extended to March 30, 2020, so if you have topics to submit it’s still possible. This conference brings together every two years all the international experts of 3D-MID, on all topics : materials, processes, reliability, applications… You will find all the information here

We are looking forward to meet you in Amberg !

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PCI, Dublin

S2P is exhibiting innovative 3D anti-tampering solutions at the Payment Card Industry (PCI) European Community meeting, in Dublin. PCI is the international Security Standards Council, driving all the requirements for the payment systems, including the integration of complex 3D meshes on electronics housing, to avoid malicius intrusion and theft of data. Joins us on booth 32 ! #pcicm #plastronique #3dmid

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Vision to products by Hahn Schickard

S2P, as a key player of 3D-MID in Europe, participates to Vision to 3D-MID Products Workshop organized by Hahn Schickard Institute in Stuttgart, where last developments and products are shown in several markets : 5G télécommunications, automotive, medical, defense and space.

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S2P is presenting innovative 3D antennas and non-developable Frequency Selective Surfaces at 40th ESA Antenna Workshop

S2P is participating to the 40th ESA Antenna Workshop in ESTEC-Netherlands, 8-10 October 2019. During this main event we will show our last developments for space applications, especially a very innovative Frequency Selective Surface part made for Thales Alenia Space for a Linear to circular polarizing reflector at 20/30 GHz. This very challenging part made by the S2P team is 300*300mm², with small patterns down to 100µm. Please contact us for more details.

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Join us on Paris Air Show 2019

International Paris Air Show opened today, we welcome you in Hall 4 booth E146 to show you:
– our last 3D miniaturized and integrated antenna solutions for lighter and miniaturized systems,
– as well as our full 3D anti-tampering security caps for high secured electronic data,
-for the Security / Defence, Aeronautics and Space markets.

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S2P Acquires new generation Pick and Place Machine

S2P has acquired a Pick and Place machine Essemtec Paraquda 2. In addition to the four placement heads, it is equipped with solder paste jetting and dispensing modules. These modules, coupled with the topographic measurement laser, allow us to assemble components on multi-level 3D-MID / plastronic parts.

With production rates up to 12300 component / hour and a placement area of 600x400x35mm, this machine perfectly meets the needs of our customers.

For your projects, contact our teams on +33 (0) 4 81 92 86 30 or by email on


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#Eurosatory – 5 days to meet S2P for your defense applications

Live – Eurosatory exhibition is now open for the next five days.

A unique opportunity to meet S2P and the powerfull 3D electronics integration for your Defense products. Hall 6 – Booth 6 FG 678

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S2P won THALES CHALLENGE and will participate to Viva Technology 2018

S2P will be at Viva Technologie 2018, the world’s rendez-vous for start-ups & leaders, with more than 80’000 participants and prestigious guests.

THALES is a key partner for S2P. World leader of electronics solutions for aerospace, security and defence, S2P collaborates with several entities of the group since several years now, working on optimizing the integration and performance of electronics functions in miniaturized and constraint plastic packagings with 3D-MID technologies.

This is a special year for us as we won the THALES CHALLENGE for Viva Technology 2018 THALES, so that THALES invited us on their lab (L15-011) to show our activities, products and solutions.

More details on :
– Chaine Youtube Thales :

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Only 10 days to submit your abstract – IEEE supported 13th International Congress Molded Interconnect Devices (MID 2018)

With only 10 days left to submit your abstract for the IEEE-supported  13th International Congress Molded Interconnect Devices (MID 2018) to be held on September 25th – 27th, 2018 at the Congress Centrum in Würzburg, Germany we cordially invite you to submit your paper : 2ndCfP_MID2018_en


  • Innovation with MID
  • MID – Implementation and Realization
  • Integrated CAD / CAM Systems
  • Materials for MID
  • Plastics Processing
  • Metallization
  • Structuring of Circuit Paths
  • 3D Assembly
  • Quality Assurance
  • Printed Electronics
  • Future Trends

All abstracts selected for the scientific track will be listed at IEEE Xplore.

Please submit your abstract until March 31st, 2018.

Further information on