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Join us on Paris Air Show 2019

International Paris Air Show opened today, we welcome you in Hall 4 booth E146 to show you:
– our last 3D miniaturized and integrated antenna solutions for lighter and miniaturized systems,
– as well as our full 3D anti-tampering security caps for high secured electronic data,
-for the Security / Defence, Aeronautics and Space markets.

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S2P Acquires new generation Pick and Place Machine

S2P has acquired a Pick and Place machine Essemtec Paraquda 2. In addition to the four placement heads, it is equipped with solder paste jetting and dispensing modules. These modules, coupled with the topographic measurement laser, allow us to assemble components on multi-level 3D-MID / plastronic parts.

With production rates up to 12300 component / hour and a placement area of 600x400x35mm, this machine perfectly meets the needs of our customers.

For your projects, contact our teams on +33 (0) 4 81 92 86 30 or by email on


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#Eurosatory – 5 days to meet S2P for your defense applications

Live – Eurosatory exhibition is now open for the next five days.

A unique opportunity to meet S2P and the powerfull 3D electronics integration for your Defense products. Hall 6 – Booth 6 FG 678

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S2P won THALES CHALLENGE and will participate to Viva Technology 2018

S2P will be at Viva Technologie 2018, the world’s rendez-vous for start-ups & leaders, with more than 80’000 participants and prestigious guests.

THALES is a key partner for S2P. World leader of electronics solutions for aerospace, security and defence, S2P collaborates with several entities of the group since several years now, working on optimizing the integration and performance of electronics functions in miniaturized and constraint plastic packagings with 3D-MID technologies.

This is a special year for us as we won the THALES CHALLENGE for Viva Technology 2018 THALES, so that THALES invited us on their lab (L15-011) to show our activities, products and solutions.

More details on :
– Chaine Youtube Thales :

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Only 10 days to submit your abstract – IEEE supported 13th International Congress Molded Interconnect Devices (MID 2018)

With only 10 days left to submit your abstract for the IEEE-supported  13th International Congress Molded Interconnect Devices (MID 2018) to be held on September 25th – 27th, 2018 at the Congress Centrum in Würzburg, Germany we cordially invite you to submit your paper : 2ndCfP_MID2018_en


  • Innovation with MID
  • MID – Implementation and Realization
  • Integrated CAD / CAM Systems
  • Materials for MID
  • Plastics Processing
  • Metallization
  • Structuring of Circuit Paths
  • 3D Assembly
  • Quality Assurance
  • Printed Electronics
  • Future Trends

All abstracts selected for the scientific track will be listed at IEEE Xplore.

Please submit your abstract until March 31st, 2018.

Further information on


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DSEI – D-DAY – Come to visit us!


DSEI, one of the major event for defense will take place in London from 12th to 15th September 2017.

S2P will exhibit our 3D-MID / Plastronics innovative solutions in defense and hope to meet you in our booth N7-443

More details on DSEI 2017 Website



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S2P cooperate with Airbus for 3D-MID integration in helicopters

S2P cooperated with Airbus to study a 3D-MID solution to simplify the assembly of helicopters cyclic grips.

Our technologies have made it possible to substitute traditional wiring with conductive tracks directly integrated on the 3D surfaces of a plastic parts.

The prototype displayed at the Paris Air Show 2017 shows the potential of 3D-MID in the automation of the production of such aeronautical systems.


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ISO 9001 Certification


The quality of our organisation is now testified by ISO 9001 Certification.

The certification has been achieved with ZERO NON-CONFORMITIES

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FIP Trade Event – at Lyon Eurexpo

S2P and its partner IPC will be present at the FIP trade show at Lyon Eurexpo (from 16th to 18th of June 2017).

This will be the occasion to present our know-how and our latest achievements in 3D-MID for the industry.

We hope to see all of you.