Only 10 days to submit your abstract – IEEE supported 13th International Congress Molded Interconnect Devices (MID 2018)

Only 10 days to submit your abstract – IEEE supported 13th International Congress Molded Interconnect Devices (MID 2018)

With only 10 days left to submit your abstract for the IEEE-supported  13^th International Congress Molded Interconnect Devices (MID 2018) to be held on September 25^th – 27^th, 2018 at the Congress Centrum in Würzburg, Germany we cordially invite you to submit your paper : 2ndCfP_MID2018_en

Topics:

• Innovation with MID
• MID – Implementation and Realization
• Integrated CAD / CAM Systems
• Materials for MID
• Plastics Processing
• Metallization
• Structuring of Circuit Paths
• 3D Assembly
• Quality Assurance
• Printed Electronics
• Future Trends

All abstracts selected for the scientific track will be listed at IEEE Xplore.

Please submit your abstract until March 31^st, 2018.

Further information on www.3dmid.de