First of all, we hope that you, your family and all your collaborators are fine, considering the difficult period we are currently facing with Covid19.
For your information, the next 3D-MID International Conference will be held on September 29th and 30th , 2020 in Amberg, Germany. S2P is still part of the organizing committee. The deadline for abstract submission has been extended to March 30, 2020, so if you have topics to submit it’s still possible. This conference brings together every two years all the international experts of 3D-MID, on all topics : materials, processes, reliability, applications… You will find all the information here https://www.3d-mid.de/en/congress-mid/
We are looking forward to meet you in Amberg !