13e Congrès 3D-MID du 25 au 27 Septembre 2018 à Würzburg – Appel à communication

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13e Congrès 3D-MID du 25 au 27 Septembre 2018 à Würzburg – Appel à communication

With only 10 days left to submit your abstract for the IEEE-supported  13th International Congress Molded Interconnect Devices (MID 2018) to be held on September 25th – 27th, 2018 at the Congress Centrum in Würzburg, Germany we cordially invite you to submit your paper : 2ndCfP_MID2018_en

Topics:

  • Innovation with MID
  • MID – Implementation and Realization
  • Integrated CAD / CAM Systems
  • Materials for MID
  • Plastics Processing
  • Metallization
  • Structuring of Circuit Paths
  • 3D Assembly
  • Quality Assurance
  • Printed Electronics
  • Future Trends

All abstracts selected for the scientific track will be listed at IEEE Xplore.

Please submit your abstract until March 31st, 2018.

Further information on www.3dmid.de