13e Congrès 3D-MID du 25 au 27 Septembre 2018 à Würzburg – Appel à communication
With only 10 days left to submit your abstract for the IEEE-supported 13th International Congress Molded Interconnect Devices (MID 2018) to be held on September 25th – 27th, 2018 at the Congress Centrum in Würzburg, Germany we cordially invite you to submit your paper : 2ndCfP_MID2018_en
Topics:
- Innovation with MID
- MID – Implementation and Realization
- Integrated CAD / CAM Systems
- Materials for MID
- Plastics Processing
- Metallization
- Structuring of Circuit Paths
- 3D Assembly
- Quality Assurance
- Printed Electronics
- Future Trends
All abstracts selected for the scientific track will be listed at IEEE Xplore.
Please submit your abstract until March 31st, 2018.
Further information on www.3dmid.de
